Thin Film Circuits
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Dry Vs. Wet Etching

 

Ion Beam Milling (Dry Etching) is a process where ions are driven into the part being etched at a high rate of speed. When the ions make contact, metal particles are then knocked off. Ion Beam Milling is not selective--it etches everything, but at different rates. Gold is one of the fastest metals to etch (1000A/sec).

 

Ion Beam Milling is the superior choice

The greatest benefit of dry etching is we can precisely duplicate the photo-resist image with no under-cut. This allows engineers to design much tighter lines and spaces for higher frequency circuits.

Ion Beam Milling (dry) provides a cleaner etching process than conventional chemical (wet) etching. Some materials such as Quartz and Platinum cannot be chemically etched without affecting other metal layers. Chemical etching can also introduce cross contamination, which degrades overall circuit performance. Dry etching offers increased yields and reliability, keeping rework down.

Etch rates for various materials

Material

Element

Etch Rate (A°/Min)

Gold

Au

1000

Aluminum

Al

400

Chromium

Cr

464

Copper

Cu

750

Tantalum Nitride

TaN

280

Nickel

Ni

440

Palladium

Pd

850

Platinum

Pt

550

Silicon

Si

225

Titanium Tungsten

Ti/W

250

Titanium

Ti

225

Silver

Ag

1400

 

Browse our pages to learn more about Etching, Ceramics, and working with us.